Article ID Journal Published Year Pages File Type
793065 Journal of Materials Processing Technology 2015 8 Pages PDF
Abstract

•A new resistive sintering process has been developed.•The major improvement is the addition of a dynamic loading up to 30 m/s.•Multiple impacts can be done.•Impacts allow lowering the sintering temperature of copper powder.

A homemade powder consolidation process combining high heating rates obtained by resistive sintering and dynamic compaction loading has been developed. The Dynamic Compaction Resistance Sintering (DCRS) device is fully automated and allows a complete regulation of the loading and temperature cycles under controlled atmosphere conditions. The general principle is to carry the electric current for sintering by means of copper Hopkinson bars. Thus, in addition to the conventional application of a constant uniaxial loading (5–100 MPa), the Hopkinson bars offer the possibility of multiple dynamic loadings at velocities up to 30 m/s. The DCRS device was tested at temperatures as high as 1850 °C and for heating rates up to 1000 °C/min. Some of the potentialities of this technique are illustrated through the low-temperature consolidation of copper under repeated dynamic loadings and high-temperature sintering of alumina.

Related Topics
Physical Sciences and Engineering Engineering Industrial and Manufacturing Engineering
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