| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 793571 | Journal of Materials Processing Technology | 2009 | 7 Pages |
Abstract
A rapid yet simple methodology to form the solder joints used in electronic packaging has been demonstrated through an induction heating system in this paper. The objective is to control the shapes of the solder joints precisely and form the hourglass-shaped solder joint using local melting phenomenon. For Sn–Ag eutectic solder bullet-shaped solder bumps and hourglass-shaped solder joints can be obtained easily within 2.3 s. The reason for the formation of hourglass-shaped solder joints has been analyzed using different morphologies of Ag3Sn intermetallic compound (IMC), and is explained by the non-uniform temperature distribution caused by a local melting phenomenon and skin effect.
Related Topics
Physical Sciences and Engineering
Engineering
Industrial and Manufacturing Engineering
Authors
Hongbo Xu, Mingyu Li, Jongmyung Kim, Daewon Kim,