Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
794569 | Journal of Materials Processing Technology | 2006 | 10 Pages |
Stress contours of an IC chip and the displacement contours of the adhesive between an IC chip and blue tape in the pick-up integrated circuit (IC) chip process are obtained using experimental and finite element methods. The physical and mechanical properties of the material used in FEM are determined by pre-experimental tests. Some factors that importantly influence the failure of a pick-up IC chip during the pick-up IC chip process are proposed. The pre-experimental material properties are manifest in the practical behavior of material, so the post-experimental results are approximately consistent with the FEM results. Post-experiments further demonstrated that the findings of this study can be used to increase the success rate of the pick-up IC chip process.