Article ID Journal Published Year Pages File Type
795086 Journal of Materials Processing Technology 2009 7 Pages PDF
Abstract

Metal-mold interfacial heat transfer coefficient (IHTC) is the most important parameter that influences the solidification rate and the mechanical properties of a solidified product. In this study, by using an inverse heat conduction problem (IHCP), the solidification experiment is optimized in order to estimate the IHTC. The number of thermal sensors and their locations are selected as experimental variables. This estimation is performed for Sn–10% Pb alloy in the metallic mold, using conjugate gradient method (CGM), based on the noisy simulated temperatures for the constant and temperature-dependent thermo-physical properties.

Related Topics
Physical Sciences and Engineering Engineering Industrial and Manufacturing Engineering
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