Article ID Journal Published Year Pages File Type
795874 Journal of Materials Processing Technology 2013 9 Pages PDF
Abstract

This study presents a technique for fast precise coating an OCA, 2012a and OCA, 2012b layer. A well-sealed loop dispensing system and a small multi-nozzle array are developed. Step-difference depth for obtaining highly reliable adhesive thickness is schemed to facilitate estimation of the total amount of adhesive needed for dispensing, and thus save on subsequent procedures such as shaving and OCA repair. The distribution method for OCA-droplet array is based on a ‘middle-dense, outer-sparse, up-down-bilateral symmetry’ strategy whereby air bubbles are expelled from gaps in the droplet array. Experimental results show that the developed one-shot adhesive dispensing technique is a highly efficient for the bonding task and encapsulation of LED (Light Emitting Diode) arrays with microelectronic chips.

► A novel one-shot OCA dispensing technique is successfully developed. ► The distribution strategy enables bubbles to be expelled from gaps in and between OCA droplets. ► The step-difference design facilitates the control of layer thickness of the OCA. ► The process time for preliminary experiments is 15 s per cycle. ► The one-shot dispensing technique has been successfully applied in bonding and packaging.

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Physical Sciences and Engineering Engineering Industrial and Manufacturing Engineering
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