| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7960773 | Computational Materials Science | 2014 | 9 Pages |
Abstract
The pronounced impact of test temperature on yield stress and rupture strain is attributed to the presence of thermal stress produced by thermal expansion mismatch upon heating.
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Alessandro Zivelonghi, Jeong-Ha You,