| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7962188 | Computational Materials Science | 2012 | 5 Pages |
Abstract
⺠Bulk and surface diffusion mechanisms are implemented and verified. ⺠Phase-field models are coupled with a thermal conduction calculation on the fly. ⺠The impact of low thermal conductivity of pores is quantified. ⺠A quantitative relationship is derived to predict the void migrating behavior.
Related Topics
Physical Sciences and Engineering
Engineering
Computational Mechanics
Authors
Liangzhe Zhang, Michael R. Tonks, Paul C. Millett, Yongfeng Zhang, Karthikeyan Chockalingam, Bulent Biner,