Effects of carbon content and size on Ti-C reaction behavior and resultant properties of Cu-Ti-C alloy system

TiC-strengthened Cu alloys with various nominal compositions were prepared by a high-energy ball-milling process, followed by consolidation using spark plasma sintering (SPS), and a subsequent heat treatment. The results indicated that the lower atomic ratio of C/Ti, the more residual Ti in copper matrix, resulting in a lower electrical conductivity but higher microhardness of alloy. The optimal atomic ratio was found to be close to1.0. The reaction behavior of Ti-C in the Cu-Ti-C system during this process was investigated. Microstructural results suggested that TiC formation is through a diffusion-controlled mechanism. A thin TiC layer was formed at the surface of C particles, and the growth of TiC layer was controlled by interdiffusion of C and Ti atoms across the TiC layer. An incomplete chemical reaction between Ti and C, characterized by a core-shell structure, was observed when the initial C particles were large, and the TiC particle size was found to strongly depending on the C particle size.