Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7971920 | Materials Science and Engineering: A | 2018 | 24 Pages |
Abstract
Ultrasound-assisted soldering of 7075 Al alloy was performed using Ni-foam reinforced Sn composite solder. The phase composition, interfacial microstructure and mechanical properties of Al/Ni-Sn/Al joints soldered for different times were investigated. Results showed that, the bonding ratio of joint was increased with increasing ultrasonic soldering time and was stabled at approximately 98% when the soldering time was longer than 20â¯s. The Ni-foam in joint was compressed into a strip type and a Ni3Sn4 intermetallic compound (IMC) layer was formed on the Ni skeleton surface, whilst an Al3Ni IMC layer was formed on the Al substrate surface. The Al3Ni phase was dot-distributed in joint soldered for 5â¯s then formed continuously in joint soldered for 15â¯s. However, further increasing the soldering time to 30â¯s resulted in the drastic growth of Al3Ni IMC layer, accompanied with the depletion of Ni3Sn4 phase. The formation and microstructure evolution mechanisms of the Al3Ni IMC layer was discussed. The measured shear strength of joint was first increased then decreased with increasing ultrasonic soldering time, and a highest shear strength of 58.0â¯MPa was obtained for joint soldered for 20â¯s.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Yong Xiao, Shan Li, Ziqi Wang, Yong Xiao, Zhipeng Song, Yongning Mao, Mingyu Li,