| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7972779 | Materials Science and Engineering: A | 2018 | 7 Pages |
Abstract
An application of this new technique is to bond thin Ag foils to Al substrates and make them bondable to die-attach materials such as solders and nano-silver paste. This Ag foil bonding method provides an alternative to the zincating process. Other potential applications include making Al surfaces easier to blaze to other metals such as brass, bronze and copper.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Shao-Wei Fu, Chin C. Lee,