Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7973808 | Materials Science and Engineering: A | 2018 | 5 Pages |
Abstract
The creep resistance of the bimodal-sized (micron+nano) TiCp/Al-Cu composite was 10-38 times and 3-6 times higher than that of the Al-Cu matrix alloy and monomodal-sized composites, respectively, attributed to strengthening effects of nano-TiCp and larger number of finer θⲠprecipitates.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Wei-Si Tian, Qing-Long Zhao, Run Geng, Feng Qiu, Qi-Chuan Jiang,