Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7973861 | Materials Science and Engineering: A | 2018 | 8 Pages |
Abstract
The effects of minor additions (0.2, 0.4 and 0.8 wt%) of Ti on the thermal stability of both Cu nanograins and Y2O3 particles in nanostructured Cu-5 vol%Y2O3 composite powder particles were investigated via 1 h isochronal annealing at temperatures ranging from 300 to 1000 °C. It was found that a small amount addition of 0.4 wt%Ti effectively inhibits the coarsening of the Y2O3 particles during annealing at a very high homologous temperature of 0.87Tm, where Tm is the melting point of Cu, which, in turn, stabilizes Cu nanograins and retains the hardness value of the as-milled powder sample. However, this is in clear contrast with the significant decrease in hardness of the Ti-free and 0.2 wt%Ti doped milled powder samples annealed at the same condition, resulting from the coarsening of the Y2O3 particles and growth of Cu nanograins. The energy dispersive X-ray spectrometry elemental analysis shows that the stabilizing mechanisms responsible for the improved thermal stability of the Y2O3 particles are associated with the chemical reactions between Ti, O and Y2O3.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Dengshan Zhou, Hongwei Geng, Wei Zeng, Dengqi Zheng, Hucheng Pan, Charlie Kong, Paul Munroe, Gang Sha, Challapalli Suryanarayana, Deliang Zhang,