Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7976694 | Materials Science and Engineering: A | 2016 | 5 Pages |
Abstract
A pure copper cylinder with micrometric grains was prepared by spark plasma sintering and was wire-drawn at room temperature. The ultimate tensile strength of the conducting wires is 600Â MPa at room temperature. This originates from the propagation of dislocations by an Orowan mechanism in grains smaller than 250Â nm.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
Claire Arnaud, Florence Lecouturier, David Mesguich, Nelson Ferreira, Geoffroy Chevallier, Claude Estournès, Alicia Weibel, Alain Peigney, Christophe Laurent,