Strength distribution of Au ball bond using nanoindentation approach

The evaluation of gold, Au ball bond requires a new approach to obtain a more localized and detailed result. This is due to the limited data in terms of quality and quantity obtained from conventional tests. The nanoindentation test is proposed in order to evaluate the quality of ball bond in more detail. The nanoindentation test was carried out to analyze the strengthening of Au ball bond after being subjected to high temperature storage, HTS. It was observed that Au and intermetallic compounds, IMC, have a higher creep behavior compared to that of silicon, Si. The dislocation glide was the responsible indentation creep mechanism for Au and IMC of ball bond that have been subjected to 0 and 1000 h of HTS. It was observed that the variation of creep behavior of Au ball bond was reduced after being subjected to 1000 h of HTS. The variation of creep behavior of IMC decreased after being subjected to 1000 h of HTS. It was also noted that the creep behavior of both Au and IMC decreased with the increase of HTS time interval. It was found that the hardness value for Au decreased with the increase of HTS time interval, whereas, the hardness value of IMC increased with the increment of HTS time interval. Based on the results obtained, it was indicated that the nanoindentation test has the ability to evaluate the strengthening of Au ball bond in a localized manner and in more detail compared to that of the conventional tests.