Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7983034 | Materials Science and Engineering: A | 2013 | 7 Pages |
Abstract
High temperature deformation behavior of Al-Si eutectic alloy was investigated by compression tests conducted at various temperatures (563, 603, 643, 683, 723, and 763Â K) with various strain rates of 0.001, 0.01, 0.05 and 1Â sâ1. Hot processing map and extrusion test were used to optimize hot processing parameters. The results that are obtained show that the main high temperature deformation mechanism of the Al-Si eutectic alloy is dislocation movement. The difference between the maximum deformation activation energy of 178Â kJ/mol and self-diffusion activation energy of pure aluminum results from rupture of eutectic silicon crystals. The deformation activation energy and instable domain decrease with increasing strain. Then the effects of strain on deformation activation energy and instable domain are negligible at higher stain than 0.4. The optimal hot processing parameters of the Al-Si eutectic allFoy are deformation temperature ranging from 660Â K to 723Â K, lower strain rate than 10â1.5Â sâ1, and strain of 0.51-1.20.
Related Topics
Physical Sciences and Engineering
Materials Science
Materials Science (General)
Authors
H.E. Hu, Xin-yun Wang, Lei Deng,