Direct printing of copper conductive micro-tracks by multi-nozzle electrohydrodynamic inkjet printing process

To overcome the limitation of low production speed of electrohydrodynamic (EHD) inkjet printing technology and to fabricate low cost electronic micro-structures, this paper presents the direct deposition of copper colloidal solution through the multi-nozzle EHD inkjet printing process. Multi-nozzle EHD inkjet printing head, consisting of five nozzles, was used for simultaneous printing of electrically conductive micro-tracks onto the glass substrate. Nozzle-to-nozzle distance and experimental conditions were optimized to prevent the interaction i.e., cross-talk between electrically charged neighboring jets. After sintering in inert (N2 gas) atmosphere, printed tracks exhibited approximately five times larger resistivity (9.20 μΩ cm) than that of the bulk copper which is a remarkable achievement. These electrically conductive micro-tracks show the feasibility of multi-nozzle EHD inkjet printing technique using the copper nano-colloidal ink for low cost fabrication of microelectronic structures and devices.