Finite element analysis of thermal stress in magnetron sputtered Ti coating

The thermal, shear and radial stresses generated in the Ti coating deposited on glass and Si substrates were investigated by finite element analysis (ANSYS). The four-node structural and quadratic element PLANE 42 with axisymmetric option were used to model the Ti coating on glass and Si substrates. The influence of deposition temperature, substrate and coating properties on the generation of thermal stress in Ti is analyzed. It is found that the thermal stress of Ti coating exhibits a linear relationship with deposition temperature and Young's modulus of the coating, but it exhibit an inverse relationship with the coating thickness. The results of simulated thermal stress are in accordance with the analytical method. The radial stress and shear stress distribution of the coating–substrate combination are calculated. It is observed that high tensile shear stress of Ti coating on glass substrate reduces its adhesive strength but high-compressive shear stress of Ti on Si substrate improves its adhesive strength.