Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7987650 | Nuclear Materials and Energy | 2016 | 5 Pages |
Abstract
A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300 µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7 µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7 µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300 MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu.
Related Topics
Physical Sciences and Engineering
Energy
Nuclear Energy and Engineering
Authors
Hiroyuki Noto, Tetsuya Yamada, Yoshimitsu Hishinuma, Takeo Muroga,