| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 7989438 | Intermetallics | 2012 | 9 Pages |
Abstract
⺠A Cu/Sn3.5Ag/Au solder joint was investigated under current stressing. ⺠The growth kinetics of Cu-Sn, Au-Sn IMCs was studied under current stressing. ⺠The mechanisms of crack and void formation were investigated. ⺠The correlation between void and Au-Sn IMCs formed was proposed.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Tsung-Chieh Chiu, Kwang-Lung Lin,