Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7989619 | International Journal of Refractory Metals and Hard Materials | 2018 | 32 Pages |
Abstract
The paper describes the design and examination of Ti/Cu double interlayer to produce a joint between tungsten and steel. Partial transient liquid phase diffusion bonding was performed by a double stage bonding process. To join tungsten to steel, the brazing of steel to a Cu interlayer (500â¯Î¼m) was carried out at 1050â¯Â°C followed by transient liquid phase diffusion bonding to tungsten using an active Ti interlayer (25â¯Î¼m) at 1000â¯Â°C. Microstructural evolution was studied at different bonding times (5, 15, 30, 60 and 180â¯min) to reveal the diffusion behavior of Ti atom in the interfacial zone between W and Cu. With the increase of the bonding time, the inserted active Ti interlayer and the formed Ti-Cu base intermetallic phases tend to be molten and consumed by the formed liquid alloy in the W-steel joint, while the tensile strength of the joint increases. The strength of the bonded specimens is as high as 412â¯MPa at the bonding time of 180â¯min. This technique provides a reliable method of bonding W to steel.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Yunzhu Ma, Wentan Zhu, Qingshan Cai, Wensheng Liu, Xinkuan Pang,