Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7989986 | Journal of Alloys and Compounds | 2018 | 6 Pages |
Abstract
We have fabricated graphene nanoplate (GNP) incorporated Cu2Se using ball milling followed by a spark plasma sintering (SPS) process. All samples have been characterized comprehensively by high resolution transmission electron microscopy, room temperature and high temperature synchrotron X-ray diffraction, differential thermal analysis, and thermoelectric properties measurements. The GNP was found to be densely and homogeneously distributed inside the matrix material, leading to a large density of grain boundaries and refined Cu2Se grains as well as GNP/Cu2Se interfaces. Despite only slight changes to the electrical conductivity, Seebeck coefficient, and power factor as a result of the GNP incorporation, the figure-of-merit (zT) in GNP incorporated Cu2Se was enhanced by a factor of up to 1.7â¯at 873â¯K compared to the undoped sample. Our results indicate that it is the GNP/Cu2Se interfaces that play an important role in the great reduction of thermal conductivity and significantly enhancement of zT. This work provides a suitable strategy to apply carbon engineering to improve thermoelectric performance in the Cu2Se and other related compounds.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Meng Li, Sheik Md Kazi Nazrul Islam, Shixue Dou, Xiaolin Wang,