Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
799161 | Mechanics Research Communications | 2012 | 8 Pages |
Abstract
This paper is concerned with the problem of bonded dissimilar, homogeneous media with a functionally graded interlayer, weakened by two offset interfacial cracks under antiplane deformation. Based on the Fourier integral transform method, formulation of the crack problem is reduced to a system of Cauchy-type singular integral equations. The mode III stress intensity factors are defined and evaluated in terms of the solution to the integral equations. Numerical results include the variations of stress intensity factors versus offset distance between the two cracks for various combinations of material and other geometric parameters of the bonded system, addressing the interaction of the two neighboring interfacial cracks spaced apart by the graded interlayer.
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Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Hyung Jip Choi,