Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
7995850 | Journal of Alloys and Compounds | 2016 | 6 Pages |
Abstract
We report the enhanced thermoelectric properties in CuxBi0.38Sb1.62Te3 compounds through simultaneous achievement of improved charge transport and suppressed thermal transport by Cu incorporation. Incorporated Cu acted as an acceptor rather than donor, resulting in the significant improvement of p-type electric conduction. Density of state effective mass was almost linearly proportional to the Cu content in the compounds, and it led to the enhancement of power factor in Cu-doped compounds regardless of the increase in hole concentration. Furthermore, reduction of bipolar and lattice thermal conductivities could also be achieved by the Cu incorporation, consequently leading to the improved thermoelectric properties of the compounds at relatively high temperatures. Effects of Cu on the thermal and charge transport properties are discussed in detail, and the controllability of the thermoelectric performance for optimum operating temperature is also reported.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Young Soo Lim, Minseok Song, Soonil Lee, Tae-Ho An, Chan Park, Won-Seon Seo,