Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8000312 | Journal of Alloys and Compounds | 2015 | 31 Pages |
Abstract
The Cu-Sn-Ga system seems to be a promising lead free solder due to properties of gallium: excellent wetting and decreasing melting temperature of Cu-Sn lead-free solder. A new experimental measurement in a solid phase as well as a new thermodynamic description of this system is presented in this work. A good agreement between calculation and available experimental data was found.
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
Dominika Jendrzejczyk-Handzlik, Krzysztof Fitzner, Wojciech Gierlotka,