Article ID Journal Published Year Pages File Type
8000312 Journal of Alloys and Compounds 2015 31 Pages PDF
Abstract
The Cu-Sn-Ga system seems to be a promising lead free solder due to properties of gallium: excellent wetting and decreasing melting temperature of Cu-Sn lead-free solder. A new experimental measurement in a solid phase as well as a new thermodynamic description of this system is presented in this work. A good agreement between calculation and available experimental data was found.
Keywords
Related Topics
Physical Sciences and Engineering Materials Science Metals and Alloys
Preview
On the Cu-Ga system: Electromotive force measurement and thermodynamic reoptimization
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