| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8003173 | Journal of Alloys and Compounds | 2012 | 10 Pages |
Abstract
⺠1 wt% Al has been added into Sn, Sn-3.5Ag (SA) and Sn-3.8Ag-0.7Cu (SAC) solders. ⺠A significant reduction in IMC growth was observed in the SAC-1Al/Cu system. ⺠A layer of η2 (AlCu) to δ (Al2Cu3) IMC was found to evolve at the solder/Cu interface.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
J.F. Li, P.A. Agyakwa, C.M. Johnson,