| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8004037 | Journal of Alloys and Compounds | 2012 | 6 Pages |
Abstract
⺠Ti additions to Sn-Cu and Sn-Ag solders can effectively reduce the undercooling. ⺠Increasing the cooling rate will increase the hardness of Ti-added solders. ⺠Ti2Sn3 networks stabilize the morphology of β-Sn even in a severe aging condition. ⺠The orientation distribution of β-Sn can be preserved after a minor addition of Ti. ⺠Ti-added solder may be a superior candidate for enhanced electromigration resistance.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Metals and Alloys
Authors
W.M. Chen, S.K. Kang, C.R. Kao,