| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 800619 | Mechanics of Materials | 2007 | 20 Pages |
Abstract
On the basis of analytical modelling of delamination of a thin film on a stretched substrate an energy model of film segmentation cracking has been formulated. The model focuses on a topological transformation between an intact and a damaged structure, rather than on a constitutive modelling of fracture itself. An energy transition condition should be satisfied in order for cracks to occur. The model provides a unique solution in the number of cracks for given material parameters. It has been validated by measuring the fracture energy of a silicon oxide thin film deposited on a poly(ethylene terephthalate) (PET) substrate, where a constant value of plastic shear stress at the film/substrate interface can be assumed.
Related Topics
Physical Sciences and Engineering
Engineering
Mechanical Engineering
Authors
Marcin Białas, Zenon Mróz,