Ultrahigh thermal conductivity copper/graphite membrane composites prepared by tape casting with hot-pressing sintering

Ultrahigh thermal conductivity Cu/graphite membrane composite with continuous well-packed laminate structure is prepared by tape casting with hot-pressing sintering. As-prepared composite material has anisotropic thermal properties with ultrahigh in-plane thermal conductivity and low in-plane coefficient of thermal expansion because of its extraordinary packed laminate structure. Thermal properties of Cu/graphite membrane composite can be designed according to requirements by adjusting volume fraction of graphite membrane in the composite. The maximum value of Cu/graphite membrane composite (50 vol% graphite membrane) in-plane thermal conductivity is 1005 W·m-1K-1, while the minimum value of the in-plane coefficient of thermal expansion is 7×10-6 K-1. This meets the high requirements for thermal management materials.