| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8012516 | Materials Letters | 2018 | 5 Pages |
Abstract
In this work, an ultrasonic-assisted semi-solid brazing method was proposed to join Al/Mg. Oxide films on substrate surfaces can be successfully removed even when filler metal was at semi-solid state. A large quantity of intermetallic compounds (IMCs) formed at 460â¯Â°C because of large amount of Al and Mg dissolved into joint caused by strong cavitation. Decreasing the temperature to 430â¯Â°C could significantly reduce IMC. However, weak cavitation happened inside low liquid phase fraction at 420â¯Â°C, making it difficult to break IMCs and solid phases.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Zhiwu Xu, Zhengwei Li, Bo Peng, Zhipeng Ma, Jiuchun Yan,