Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8012544 | Materials Letters | 2018 | 14 Pages |
Abstract
Cu wires can be significantly strengthened without losing much conductivity if a continuous nanolamellar structure with Cu and a strong second constituent is achieved. We report on a nanolamellar Cu/steel wire fabricated by repetitive hot-pressing, forging, rolling and subsequent wire drawing. Austenization and quenching in liquid nitrogen resulted in a Cu/martensite structure, exhibiting tensile strength of 1220â¯MPa. The electrical conductivity of the wire was measured to be about 60% International Annealed Copper Standard (IACS), which was comparable with Cu/Fe fabricated by alloying and casting. In situ tensile tests under high energy X-ray diffraction were utilized to explore the deformation behavior of the wire. It was found that the martensite carried about 60% of the load, accounting for the high strength.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Yadong Ru, Kaiyuan Yu, Fangmin Guo, Yang Ren, Lishan Cui,