| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 801351 | Precision Engineering | 2012 | 12 Pages |
A study was carried out to investigate the crystallographic effects on the performance of cutting poly-crystalline oxygen free copper C10200 (OFC) with single crystalline diamond (SCD) micro-tools. At both large cutting depth and cross-feed rate, as the micro-tool traversed a grain with a crystallographic orientation less favorable for a stable machining process, the work material in front of the rake face was found to be severely deformed. This may lead to a reduced shear angle, thick chip, striation at the back of the chip, high cutting forces, degraded machined surface and the possibility of burr formation. The results showed minimal variations in the machined surface integrity and cutting forces compared to cut amorphous NiP plating with micro-tools. For a high cutting depth, burrs were also observed due to material deformation and pile-up occurring at the groove edges since the localized stress probably built up in front of the rake face. Cutting strategies were demonstrated to improve the performance of cutting OFC with micro-tools and to generate high aspect ratio micro-pillar arrays.
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► A change in crystallographic structure, such as grain size and grain orientation resulted in a distinct variation in the machining force, chip thickness, chip striation, and shear angle during micro-machining. ► The micro-machining conditions change when the machining is carried out across grains with various crystallographic orientations due to the variation in the crystal density. ► Cutting strategies were demonstrated to improve the performance of cutting OFC with micro-tools and to generate high aspect ratio micro-pillar array.
