The novel Cu nanoaggregates formed by 5 nm Cu nanoparticles with high sintering performance at low temperature

In this paper, we have developed a new type of Cu nanoaggregates, which were agglomerated by 5 nm Cu nanoparticles. The nanoaggregates can be well sintered at very low temperature, and an excellent resistivity of 4.37 μΩ cm was achieved after sintering at 250 °C, which is only 2.5 times larger than that of Cu bulk. A novel mechanism has been put forward to elucidate the sintering behavior for the Cu nanoaggregates. With the advantage of high sintering performance, this type of Cu nanoaggregates is promising to be widely used in various fields, such as printed electronics and microelectronic packaging.