| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8015076 | Materials Letters | 2018 | 4 Pages |
Abstract
In this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction and fracture behavior of the aged SnBiAg/Cu solder joints were investigated. The results reveal that the Ag element in the solder can diffuse into the Cu substrate during the soldering and aging process, forming a Cu-Ag alloy layer around the joint interface. The Bi segregation was not observed at the aged SnBiAg/Cu interface, and the embrittlement will not occur at the aged SnBiAg/Cu solder joints once the Bi segregation was restrained.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
F.Q. Hu, Q.K. Zhang, J.J. Jiang, Z.L. Song,