Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
802052 | Mechanics Research Communications | 2006 | 9 Pages |
Today many electronic devices consist of plate-like printed circuit boards carrying electric and electronic components mounted in some sort of housing. Depending on the application, these electronic devices may be subjected to severe random vibration loads over their lifetime, e.g. in automotive or aerospace environments. The present work shows that although state-of-the-art printed circuit boards are typically structurally linear with respect to stiffness properties, they are usually characterized by strongly nonlinear damping characteristics that have to be taken into account for proper vibration modelling and testing of corresponding devices. An approach allowing the nonlinear damping characteristics observed to be properly taken into account for testing and life-time prediction purposes is presented.