Article ID Journal Published Year Pages File Type
802052 Mechanics Research Communications 2006 9 Pages PDF
Abstract

Today many electronic devices consist of plate-like printed circuit boards carrying electric and electronic components mounted in some sort of housing. Depending on the application, these electronic devices may be subjected to severe random vibration loads over their lifetime, e.g. in automotive or aerospace environments. The present work shows that although state-of-the-art printed circuit boards are typically structurally linear with respect to stiffness properties, they are usually characterized by strongly nonlinear damping characteristics that have to be taken into account for proper vibration modelling and testing of corresponding devices. An approach allowing the nonlinear damping characteristics observed to be properly taken into account for testing and life-time prediction purposes is presented.

Related Topics
Physical Sciences and Engineering Engineering Mechanical Engineering
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