Fabrication of metal electrodes on flexible substrates by controlled deposition of conductive nano-ink

In this study, a novel process was developed for the fabrication of ultrafine electrodes on flexible substrates. Conductive fine electrodes using silver nano-ink on polyimide (PI) film were obtained by means of plasma-enhanced superhydrophobic technology. The plasma etching conditions were optimized for the formation of a superhydrophobic layer on the surface of the PI film. A micro-trench on the hydrophobic PI film was then formed by mechanical scratching, thus imparting hydrophilic properties only to the trench area. Finally, the fine electrode was realized by the selective deposition of aqueous silver nano-ink on the trench region. The electrical properties of the conductive electrodes fabricated using silver nano-ink with an average particle size of 50 or 200 nm were investigated and the microstructure of the electrodes was observed using an electron microscope at sintering temperatures ranging from 150 to 400 °C. In addition, the addition effect of silver nanowire to silver nano-ink was examined to assess the improvement on the conductive properties of electrode.