Influence of texture of Cu on the growth of Cu-Sn intermetallic compounds

Influence of Cu texture orientation on the growths of IMCs in the joints with small volume of solder (10 μm electroplated Sn layer) was investigated. IMCs (Cu6Sn5 and Cu3Sn) formed on the Cu with different texture orientation displayed different morphologies. The average grain size of IMCs on the electroplated Cu with text orientation (220) is larger than that of Cu substrate with the text orientation (200), and the thickness of the IMCs at the electroplated Cu (220) is larger than those formed at the Cu substrate (200). After aging at 150 °C for 96 h, the IMCs almost penetrated the entire Sn layer at some points.