Electroless deposition and evaluation of Cu/multiwalled carbon nanotube composite films on acrylonitrile butadiene styrene resin

Cu/multiwalled carbon nanotube (MWCNT) composite films were fabricated by electroless deposition on acrylonitrile butadiene styrene (ABS) resin substrates. Four types of MWCNTs with different dimensions were added to the electroless copper plating baths together with the dispersants sodium lauryl sulfate and hydroxypropyl cellulose. The ABS resin substrates were first subjected to a roughening treatment to improve film adhesion. The microstructure of the composite films was characterized, and it was found that the MWCNTs were uniformly dispersed. The adhesion strength for the films was as high as that for electroless copper films. The composite films had an electrical resistivity in the range of 2.39-2.72 μΩ cm, and their coefficient of friction was considerably lower than that for electroless copper films.