| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8028802 | Surface and Coatings Technology | 2013 | 5 Pages |
Abstract
The feasibility of using electroplated Ni-xZn films was evaluated for a new application as the under bump metallization. Considering the alloy films in electroplating process, determining the deposition potential (affecting nucleation) and current density (affecting growth) is crucial. A suitable Ni-5Zn film exhibiting smooth and dense surface was derived at a low current density of 0.067Â ASD. After a 30Â s liquid reaction, intermetallic phase formation and Cu6Sn5 growth at the interface were visualized and analyzed using a field-emission electron probe microanalyzer. This study demonstrated that binary Ni-Zn films fabricated by electroplating might be a potential candidate for under bump metallization application.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Hsiu-Min Lin, Jenq-Gong Duh,