Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8029665 | Surface and Coatings Technology | 2013 | 7 Pages |
Abstract
In this work, the deposition of gold on copper substrates from solutions of HAuCl4.3H2O in 1-butyl-1-methylpyrrolidinium dicyanamide was studied. Deposition was carried out in open-circuit and under potentiostatic control at temperatures from 293 to 353Â K, in normal atmosphere, with deposition conditions allowing water from atmospheric absorption up to 0.8Â wt.%. Films of gold were obtained by both methods. Deposition at open-circuit occurs by galvanic displacement mechanism. Involvement of Cu+ species in the electrodeposition process was suggested by cyclic voltammetry. Furthermore, copper incorporation in the gold films was confirmed by X-ray diffraction. SEM observation and XRD analysis show that films are nanocrystalline with a globular morphology except for the films formed under potentiostatic control at 353Â K, which show a dendritic structure. The size of the crystallites determined by Scherrer's equation varies in the range from 6 to 25Â nm.
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Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
A.I. de Sá, S. Eugénio, S. Quaresma, C.M. Rangel, R. Vilar,