Article ID Journal Published Year Pages File Type
8029665 Surface and Coatings Technology 2013 7 Pages PDF
Abstract
In this work, the deposition of gold on copper substrates from solutions of HAuCl4.3H2O in 1-butyl-1-methylpyrrolidinium dicyanamide was studied. Deposition was carried out in open-circuit and under potentiostatic control at temperatures from 293 to 353 K, in normal atmosphere, with deposition conditions allowing water from atmospheric absorption up to 0.8 wt.%. Films of gold were obtained by both methods. Deposition at open-circuit occurs by galvanic displacement mechanism. Involvement of Cu+ species in the electrodeposition process was suggested by cyclic voltammetry. Furthermore, copper incorporation in the gold films was confirmed by X-ray diffraction. SEM observation and XRD analysis show that films are nanocrystalline with a globular morphology except for the films formed under potentiostatic control at 353 K, which show a dendritic structure. The size of the crystallites determined by Scherrer's equation varies in the range from 6 to 25 nm.
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Physical Sciences and Engineering Materials Science Nanotechnology
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