Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8029870 | Surface and Coatings Technology | 2013 | 6 Pages |
Abstract
The physicochemical regularities of chemical vapor deposition (CVD) of nickel films from bis-(ethylcyclopentadienyl) nickel [(EtCp)2Ni] have been experimentally studied for two reaction systems: (EtCp)2Ni-H2-Ar and (EtCp)2Ni-Ar. A model reaction scheme of (EtCp)2Ni transformations has been developed in accordance with the data from the time-of-flight mass-spectrometry of the reaction gas phase. The results from a study of process kinetics and morphology of the deposited layers show that the growth process is controlled by nucleation step in the deposition temperature range 760-840 K in case of (EtCp)2Ni pyrolysis and within the interval 640-810 K when hydrogen is added (at P[(EtCp)2Ni] = 75 Pa). The values of activation energy of the processes are 189 ± 9 and 115 ± 6 kJ·molâ 1 for the temperature ranges mentioned, respectively.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
V.S. Protopopova, S.E. Alexandrov,