Article ID Journal Published Year Pages File Type
8029870 Surface and Coatings Technology 2013 6 Pages PDF
Abstract
The physicochemical regularities of chemical vapor deposition (CVD) of nickel films from bis-(ethylcyclopentadienyl) nickel [(EtCp)2Ni] have been experimentally studied for two reaction systems: (EtCp)2Ni-H2-Ar and (EtCp)2Ni-Ar. A model reaction scheme of (EtCp)2Ni transformations has been developed in accordance with the data from the time-of-flight mass-spectrometry of the reaction gas phase. The results from a study of process kinetics and morphology of the deposited layers show that the growth process is controlled by nucleation step in the deposition temperature range 760-840 K in case of (EtCp)2Ni pyrolysis and within the interval 640-810 K when hydrogen is added (at P[(EtCp)2Ni] = 75 Pa). The values of activation energy of the processes are 189 ± 9 and 115 ± 6 kJ·mol− 1 for the temperature ranges mentioned, respectively.
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Physical Sciences and Engineering Materials Science Nanotechnology
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