| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8030406 | Surface and Coatings Technology | 2013 | 11 Pages |
Abstract
⺠Grain refinement is due to change in nucleation, growth and defect structure. ⺠Nucleation mode is changed from instantaneous to progressive with thiourea addition. ⺠Growth is inhibited by segregation of thiourea at the grain boundaries. ⺠The copper electrodeposit prepared without addition of thiourea reveals dislocations. ⺠Grain refinement is due to predominant formation of twins in presence of thiourea.
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Authors
K. Shravan Kumar, Krishanu Biswas,