| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8030545 | Surface and Coatings Technology | 2013 | 7 Pages |
Abstract
⺠Interfacial adhesion of TiN/Al films is predicted and verified by simulations and analytical solutions. ⺠Fracture energy of dissimilar materials is simulated based on J-integral method and VCCT. ⺠Mode-I of fracture modes is dominant in the adhesive measurement of 4-PBT. ⺠Pattern effect of metal lines on fracture energy of TiN/Al interface is investigated. ⺠Dielectrics with low modulus underneath TiN/Al interface have a capability to arrest crack growth.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
Chang-Chun Lee,