| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8030913 | Surface and Coatings Technology | 2012 | 8 Pages |
Abstract
⺠The interface in the Cu-C system was modified by boron and niobium interlayers. ⺠Thermal treatment of the samples simulated the production process of Cu-diamond MMCs. ⺠The TCR of the interface was investigated by modulated infrared radiometry. ⺠Chemical- and diffusion processes were investigated by TEM of interlayer cross sections. ⺠Very thin interlayers improve the mechanical and thermal interfaces.
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Authors
J. Hell, M. Chirtoc, C. Eisenmenger-Sittner, H. Hutter, N. Kornfeind, P. Kijamnajsuk, M. Kitzmantel, E. Neubauer, K. Zellhofer,