| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8030981 | Surface and Coatings Technology | 2012 | 8 Pages |
Abstract
⺠DLC bilayers with Cu functional layer are prepared by double-excitated cathode arc method. ⺠Cu/DLC bilayer facilitates graphitic rearrangement but DLC/Cu can be against graphitization. ⺠A three-layer diffusion model is used to describe the diffusion of Cu and C layers. ⺠Both DLC bilayers showed highly dispersed nano-agglomerates on the surface. ⺠DLC/Cu bilayer annealed at 100-400 °C showed a higher hardness and lower stress.
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Authors
Bing Zhou, A.V. Rogachev, Zhubo Liu, Xiaohong Jiang, Ruiqi Shen, A.S. Rudenkov,