| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8031516 | Surface and Coatings Technology | 2012 | 7 Pages |
Abstract
⺠Ti-Al-Si-N films doped with various Cu contents were deposited by arc ion plating. ⺠The films are composed of nano-crystalline TiAlN, Cu and amorphous Si3N4. ⺠Friction coefficient decrease with increasing copper content. ⺠Adhesive strength increase with increasing copper content.
Keywords
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
J. Shi, A. Kumar, L. Zhang, X. Jiang, Z.L. Pei, J. Gong, C. Sun,