| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8031553 | Surface and Coatings Technology | 2012 | 5 Pages |
Abstract
⺠Pd-free activation of dielectrics prior its metallization. ⺠Colloidal Co-based solution as an activator. ⺠Pd-free electroless copper metallization.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
L. NaruÅ¡keviÄius, L. TamaÅ¡auskaitÄ-TamaÅ¡iÅ«naitÄ, A. ŽielienÄ, V. JasulaitienÄ,