| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8031895 | Surface and Coatings Technology | 2012 | 8 Pages |
Abstract
⺠Investigation of Cu diffusion barriers in Ti-Si-C based nanocomposite contacts. ⺠Sputtered Ni or Ti layers combined with Ti-Si-C-Ag coatings can hinder Cu diffusion. ⺠Cu diffusion can be hindered combining electroplated Ni with Ti-Si-C or Ti-Si-C-Ag.
Related Topics
Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
N.G. Sarius, J. Lauridsen, E. Lewin, J. Lu, H. Högberg, Ã
. Ãberg, H. Ljungcrantz, P. Leisner, P. Eklund, L. Hultman,