| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8032133 | Surface and Coatings Technology | 2011 | 8 Pages |
Abstract
⺠Pulsed magnetron sputtering was used for size-controlled deposition of Cu clusters. ⺠Size of the clusters can be controlled by the frequency and duty cycle of pulses. ⺠Size of deposited clusters is observed about 105 amu and /or 8-10 nm in diameter. ⺠The cluster mass flux is not dependent on frequency or duty cycle.
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Physical Sciences and Engineering
Materials Science
Nanotechnology
Authors
VÃtÄzslav StraÅák, Stephan Block, Steffen Drache, ZdenÄk HubiÄka, Christiane A. Helm, LubomÃr JastrabÃk, Milan Tichý, Rainer Hippler,