| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 8032273 | Surface and Coatings Technology | 2011 | 6 Pages |
Abstract
âºSn-(0.24-26.5) wt.% Co alloy layers (5-10 μm) were electrodeposited on Cu substrate. âºConditions tested included heating at 170 °C for 200 h followed by 20 h at 205 °C. âºFormation of Sn-Co intermetallics in the layers was dependent on the Co content. âºIn the Sn-(11-26.5) wt. Co/Cu system, Cu6Sn5 and Cu3Sn did not form after heating.
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Authors
IngrÄ«da VÄ«tiÅa, Velta Belmane, Aija KrÅ«miÅa, Valda Rubene,