Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
8033917 | Thin Solid Films | 2015 | 4 Pages |
Abstract
The crystallization behavior of ultrathin Ti0.43Sb2Te3 (TST) films dependent on thickness was studied. As the film thickness decreases, the crystallization temperature (Tc) firstly increases in the thickness range of 10-50Â nm, and then decreases when the thickness is less than 10Â nm. Two factors can explain the variation trend of Tc with decreasing thickness of TST films. The increment of Tc is mainly due to the crystallization suppression originating from the increment of surface-to-volume in 10-50Â nm TST films, and the decrement is dominantly attributed to the crystallization promoter of substrate/film interface in sub-10Â nm TST films. The current-voltage and resistance-voltage measurements of 50Â nm-TST-based and 10Â nm-TST-based devices exhibit that 10Â nm-TST-based device can realize low voltage and low power operation, but owns relatively lower speed for its longer incubation time.
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Authors
Le Li, Sannian Song, Zhonghua Zhang, Yueqing Zhu, Zhitang Song, Yan Cheng, Shilong Lv, Bo Liu, Liangliang Chen,